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Machine Vision Solutions

3D Imaging

 

Your 3D Technology Partner: From Sensors to Solutions

Teledyne Vision Solutions delivers a full spectrum of advanced 3D imaging technology for high-performance industrial applications. Our offering includes high-precision 3D sensors, laser profilers, and stereo vision systems that are engineered for accuracy and reliability.

We support a wide range of industries including automation, healthcare, aerospace, and geospatial with solutions designed to improve inspection accuracy and enable precise spatial analysis. Our technologies are built to integrate easily into a wide range of advanced imaging systems and help our customers accelerate system deployment.

Teledyne Vision Solutions is a trusted partner for organizations that need scalable, future-ready 3D imaging solutions. We are focused on innovation and long-term support and are committed to delivering results through proven 3D technology that is ready to perform.

Applications

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Robotics & Automation

  • Navigation
  • Pick & place
  • Bin picking & object recognition
  • Robot vision & guidance
  • General inspection & quality control
  • Food processing & sorting
  • In-line small parts inspection
  • Glue bead / weld seam inspection

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EV power components

  • General battery inspection
  • Flow channel plate inspection
  • Film inspection (catalyst foil, battery film)
  • Cavity inspection

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Healthcare & Medical

  • Imaging & diagnostics
  • Surgical navigation, tracking & planning (including robotic surgery)
  • Endoscopy / minimally invasive procedures
  • Rehabilitation & posture analytics
  • Lab automation / life science imaging
  • Dermatological & wound analysis
  • Medical device inspection

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Aerospace & Defense

  • Drones and UAVs
  • Composite material profiling (uniformity in carbon fiber and advanced materials)
  • Surface inspection of aircraft components
  • Terrain mapping for UAVs and drones

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Semiconductors

  • Wafer inspection (thickness, flatness, surface defects)
  • Mask / wafer / glass / film inspection
  • Wafer bonding and multi-die carrier inspection
  • Die alignment and placement
  • Package and solder joint analysis
  • Paste and wire bond inspection
  • PCB inspection
  • Connector and terminal inspection

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Geospatial & Mapping

  • Construction & building mapping
  • HD mapping
  • Architecture, Engineering and Construction (AEC) surveying
  • Roadway maintenance
  • Asset management
  • Transportation corridor mapping

Our 3D Technologies

Time-of-Flight

Laser Triangulation

Stereo

3D Imaging Articles
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Article

Advancing Stereo Depth Perception in Industrial Automation

더 알아보기
Article

Has 3D Finally Come of Age?

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Customer Story

국제 협력을 위해 설계된 매우 정확하고 활용도 높은 3D 현미경

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Article

Tech Briefs article – Time-of-Flight: Highly Reliable 3D Imaging for Challenging Applications

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Recommended Products

3D Image Sensors & Modules
Laser Profilers
Stereo Camera