Search

  • Teledyne announces next generation 5GigE area scan camera platform

    Teledyne FLIR is pleased to announce the Forge 5GigE area scan camera family for machine vision. Constructed on an all-new modern platform, Forge is designed to provide the richest combination of advanced imaging features in the industry and is engineered to handle the most complex vision system challenges both now and into the future.

  • Teledyne introduces Contact Image Sensors for high-speed, high-resolution line scan imaging

    Teledyne DALSA is pleased to introduce AxCIS™, a new family of high-speed and high-resolution fully integrated line scan imaging modules. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications.

  • Teledyne to exhibit an unmatched range of new industrial imaging technologies at The Vision Show

    Teledyne will showcase their newest products and solutions at The Vision Show taking place October 11-13, in Boston, Massachusetts.Teledyne’s DALSA, e2v, FLIR and Lumenera businesses will display the world’s most comprehensive, vertically integrated portfolio of industrial imaging technology. Visit Teledyne booth #227 and explore unmatched capabilities and products from your one source for unlimited vision solutions partner.

  • Teledyne expands its Genie™ Nano portfolio with new 10GigE cameras

    Teledyne DALSA is pleased to announce the all-new Genie Nano-10GigE M/C8200, and M/C6200, based on Teledyne e2v’s 67M and 37M monochrome and color sensors. The new Genie Nano-10GigE series delivers a futureproof and scalable solution with significantly higher interface speeds and resolutions, offering system designers an easy integration path for application upgrades requiring higher speed data capture and transfers.

  • Teledyne DALSA announces its new line of high-performance X-ray detectors at RSNA 2022

    Teledyne will introduce its breakthrough line of X-ray detectors that narrows the gap between amorphous silicon and CMOS-based detectors at RSNA 2022. The new Axios flat panel detector series, designed and manufactured entirely by Teledyne, are based on an innovative IGZO technology, proprietary new image chain and use the highest performance components. The Axios product line is engineered to deliver an unprecedented balance of performance and value, while addressing the needs of the most demanding real-time applications for diagnostic and interventional imaging like orthopedics, vascular cardiology and surgery.

  • Teledyne cameras enable VR play at TOCA Social

    TOCA Social has created a vibrant destination to eat, drink and play, and it serves as a place where friends and family are able to kick up a storm in their own personal playing booths called boxes. Choosing from a variety of interactive soccer-based games, enabled by innovative ball delivery, and tracking technology, TOCA Social bridges the physical and digital worlds in a way never seen before.

  • Teledyne to present its newest scientific imaging and machine vision solutions at SPIE’s Photonics West exhibition.

    Teledyne will showcase their newest products and solutions at SPIE’s Photonics West exhibition taking place January 31 – February 2nd, 2023, in San Francisco, California. Visitors to the Teledyne booth #1527 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Imaging Sensors, Acton Optics, Judson, Lumenera, Photometrics, and Princeton Instruments.

  • Teledyne DALSA to showcase new IGZO-based X-ray detectors at IDS 2023

    Teledyne DALSA is pleased to exhibit at IDS 2023 where they will present their recently introduced Axios Indium Gallium Zinc Oxide (IGZO) X-ray detectors together with their premium line of Xineos CMOS-based detectors. The exhibition takes place March 14-18 in Cologne, Germany.

  • Teledyne introduces 4K 3D laser line profile sensor family for in-line measurement

    Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company and global leader in machine vision technology, is pleased to introduce the Z-Trak™ LP2C 3D profile sensor family for in-line 3D measurement and inspection applications. As the latest member of the Z-Trak family, the LP2C 4K sensors deliver 4,096 samples per profile and an x resolution down to 3.5 microns, allowing customers to measure and inspect parts with tighter tolerances, and to identify smaller defects cost effectively.

  • Teledyne introduces shutterless version of its compact thermal camera core

    Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, is pleased to announce a shutterless version of its MicroCalibir™ Long Wave Infrared (LWIR) compact camera platform.

  • New high performance 5GigE multispectral line scan camera from Teledyne extends vision capability

    Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce that its Linea™2 4k Multispectral 5GigE line scan camera is now in production. This new camera takes vision systems to the next level with its performance and value, offering a 5GigE interface with five times the bandwidth of the Linea GigE camera.

  • Teledyne’s backside illuminated TDI camera delivers greater sensitivity for near ultraviolet and visible imaging

    The new Linea HS 16k BSI uses Teledyne DALSA’s charge-domain CMOS TDI 16k sensor with a 5x5 μm pixel size and delivers a maximum line rate of 400 kHz aggregate. Compared with Front Side Illumination (FSI), the BSI model significantly improves quantum efficiency in the near ultraviolet and visible wavelengths and boosts signal-to-noise ratio for imaging applications in light starved conditions.