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MIL LAB: Solving Problems
MIL LAB: Solving Problems - Critical Cleanliness Control (C3), Dye & Pull, and Cross-Section
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Cleaning the imaging surface of your camera
This article details an appropriate method for cleaning your camera's protective glass surface or sensor package window.
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Teledyne DALSA’s unrivaled CMOS X-ray detectors highlighted at CMEF 2020
Teledyne DALSA will showcase its proprietary software for generic tomosynthesis reconstruction, which supports various imaging geometries and scanning approaches. The new software technology enables X-ray tomosynthesis imaging modalities that speed the integration of X-ray detectors and deliver new opportunities for system-level innovation.
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Teledyne Imaging’s new Z-Trak2 family of 3D profile sensors delivers up to 45K profiles/sec
Teledyne Imaging, a Teledyne Technologies [NYSE: TDY] company and global leader in machine vision technology, launches Z-TrakTM2, its newest family of 3D profile sensors. Built on Teledyne Imaging’s 3D image sensor technology, Z-Trak2 ushers in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications. Models deliver scan speeds of up to 45,000 profiles per second and features built-in HDR and reflection compensation algorithms to handle surfaces with varying degrees of reflectivity in a single scan.
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New high-resolution CoaXPress cameras engineered for long-term reliability in harsh environments
The newest Genie Nano models are easy-to-use and feature a CoaXPress interface. The cameras are engineered for industrial imaging applications requiring high-speed data transfer, such as industrial automation, electronics manufacturing, packaging inspection, semiconductor inspection, PCB-AOI (Automated Optical Inspection), and general machine vision. Designed for a wider range of operating temperatures (from -20°C to 60°C housing temperature), the cameras can be integrated in harsh environments in imaging systems and increases their long-term reliability.
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Teledyne Imaging’s new software release supports USB3 Vision cameras and improves performance for high-speed 5GigE models
latest release of the SaperaTM LT software development kit (SDK). Sapera LT 8.60 offers a USB3 device manager to select supported USB3 cameras and protocols. Teledyne Imaging area scan customers can benefit from a unified SDK support across a wide range of camera interfaces from USB3 Vision and GigE Vision, to Camera Link, CoaXPress, and Camera Link HS.
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Teledyne Imaging to present its latest vision solutions at Automate Forward Virtual Conference
Teledyne Imaging, a part of Teledyne Technologies [NYSE: TDY], and global leader in machine vision technology, will showcase their newest technologies at the Automate Forward Trade Show and Conference taking place March 22-26, 2021. Visitors to the virtual event can expect a wide range of new products and innovative solutions for robotics and automation. Product specialists will be available to text and video chat with you about your specific requirements.
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Teledyne introduces its new compact thermal camera core
Teledyne is pleased to introduce the MicroCalibir™, a new compact, low-power camera platform. This latest uncooled thermal camera platform features the smallest VGA IR core module on the market, making it ideal for OEM drones, handhelds, helmet-mounted and vehicular integration products.
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Quality Magazine Article – Unleashing Potential: How Advances in 3D Vision Sensors are Transforming Manufacturing and Logistics
MANUFACTURERS CAN RELY ON SOPHISTICATED SENSORS TO REVOLUTIONIZE THE WAY THEY DO BUSINESS, ENABLING ENHANCED QUALITY CONTROL, IMPROVED EFFICIENCY, AND INCREASED SAFETY.
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The Future of CMOS is Stacked
Custom stacked CMOS sensors will add new performance and features in a tiny package
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Technical Paper – Starlight Image Sensor Technology
Teledyne e2v has published this article on the latest technologies dedicated to vision in extreme darkness. Low-light applications require sufficient video throughput, signal-to-noise ratio, and spatial resolution to allow human interpretation of a complex scene passing through the digitization channel.
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Teledyne e2v releases 1.5 Megapixel version of Optimom, a turnkey optical module for quick and easy development of vision systems
Optimom 1.5M is a complete board-level vision extension made to accelerate development time, reduce R&D investment, and scale down manufacturing costs for embedded vision and AI vision solutions. It comprises of a proprietary image sensor, a tiny 25mm square board with lens mount, and optional lens in various options.
