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Teledyne to present its newest scientific imaging and machine vision solutions at SPIE’s Photonics West exhibition.
Teledyne will showcase their newest products and solutions at SPIE’s Photonics West exhibition taking place January 31 – February 2nd, 2023, in San Francisco, California. Visitors to the Teledyne booth #1527 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Imaging Sensors, Acton Optics, Judson, Lumenera, Photometrics, and Princeton Instruments.
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Teledyne DALSA to showcase new IGZO-based X-ray detectors at IDS 2023
Teledyne DALSA is pleased to exhibit at IDS 2023 where they will present their recently introduced Axios Indium Gallium Zinc Oxide (IGZO) X-ray detectors together with their premium line of Xineos CMOS-based detectors. The exhibition takes place March 14-18 in Cologne, Germany.
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Teledyne introduces 4K 3D laser line profile sensor family for in-line measurement
Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company and global leader in machine vision technology, is pleased to introduce the Z-Trak™ LP2C 3D profile sensor family for in-line 3D measurement and inspection applications. As the latest member of the Z-Trak family, the LP2C 4K sensors deliver 4,096 samples per profile and an x resolution down to 3.5 microns, allowing customers to measure and inspect parts with tighter tolerances, and to identify smaller defects cost effectively.
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Teledyne introduces shutterless version of its compact thermal camera core
Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, is pleased to announce a shutterless version of its MicroCalibir™ Long Wave Infrared (LWIR) compact camera platform.
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New high performance 5GigE multispectral line scan camera from Teledyne extends vision capability
Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce that its Linea™2 4k Multispectral 5GigE line scan camera is now in production. This new camera takes vision systems to the next level with its performance and value, offering a 5GigE interface with five times the bandwidth of the Linea GigE camera.
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Teledyne’s backside illuminated TDI camera delivers greater sensitivity for near ultraviolet and visible imaging
The new Linea HS 16k BSI uses Teledyne DALSA’s charge-domain CMOS TDI 16k sensor with a 5x5 μm pixel size and delivers a maximum line rate of 400 kHz aggregate. Compared with Front Side Illumination (FSI), the BSI model significantly improves quantum efficiency in the near ultraviolet and visible wavelengths and boosts signal-to-noise ratio for imaging applications in light starved conditions.
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Download PVCAM SDK 3.10.1.1
The PVCAM Software Development Kit allows you to integrate Teledyne Photometrics PVCAM based cameras into other software packages.
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Teledyne Photometrics Legacy Drivers & Software
Downloads & Drivers for Legacy Teledyne Photometrics Products
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Teledyne strengthens its position as the number one independent multi-product MEMS foundry in the world
Teledyne DALSA and Teledyne Micralyne, both Teledyne Technologies [NYSE:TDY] companies, announce the combination of their powerful and wide-ranging capabilities with a new brochure and video for the MEMS and semiconductor industry
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As Fast As You Can: Hot Box Detectors Across China
How high-speed thermal imaging helped leading rail companies tackle new challenges in safety for national rail networks
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Hot Wheels: Can thermal imaging and better hotboxes improve rail safety?
News headlines highlight the global challenges in preventing train derailments and potential solutions
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New GigE and USB3 cameras designed for use in challenging lighting conditions
Teledyne Imaging, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision, is pleased to announce the extension of its Teledyne DALSA Genie Nano-1G Camera Series and Teledyne Lumenera Lt Series USB3 cameras based on third generation Sony® Pregius® Global Shutter CMOS sensors.
