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Teledyne introduces 4K 3D laser line profile sensor family for in-line measurement
Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company and global leader in machine vision technology, is pleased to introduce the Z-Trak™ LP2C 3D profile sensor family for in-line 3D measurement and inspection applications. As the latest member of the Z-Trak family, the LP2C 4K sensors deliver 4,096 samples per profile and an x resolution down to 3.5 microns, allowing customers to measure and inspect parts with tighter tolerances, and to identify smaller defects cost effectively.
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Teledyne introduces shutterless version of its compact thermal camera core
Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, is pleased to announce a shutterless version of its MicroCalibir™ Long Wave Infrared (LWIR) compact camera platform.
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Download PVCAM SDK 3.10.1.1
The PVCAM Software Development Kit allows you to integrate Teledyne Photometrics PVCAM based cameras into other software packages.
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Teledyne Photometrics Legacy Drivers & Software
Downloads & Drivers for Legacy Teledyne Photometrics Products
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Teledyne strengthens its position as the number one independent multi-product MEMS foundry in the world
Teledyne DALSA and Teledyne Micralyne, both Teledyne Technologies [NYSE:TDY] companies, announce the combination of their powerful and wide-ranging capabilities with a new brochure and video for the MEMS and semiconductor industry
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As Fast As You Can: Hot Box Detectors Across China
How high-speed thermal imaging helped leading rail companies tackle new challenges in safety for national rail networks
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Hot Wheels: Can thermal imaging and better hotboxes improve rail safety?
News headlines highlight the global challenges in preventing train derailments and potential solutions
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New GigE and USB3 cameras designed for use in challenging lighting conditions
Teledyne Imaging, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision, is pleased to announce the extension of its Teledyne DALSA Genie Nano-1G Camera Series and Teledyne Lumenera Lt Series USB3 cameras based on third generation Sony® Pregius® Global Shutter CMOS sensors.
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e2v advanced CMOS image sensor solutions now available with new state-of-the-art TowerJazz technology
e2v, the global innovator of imaging solutions and TowerJazz, the global specialty foundry leader, have today announced that e2v’s standard and custom CMOS image sensor solutions are now available with a newly developed generation of global shutter pixels. This advanced solution has been developed by TowerJazz at TowerJazz Panasonic Semiconductor Co.
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Teledyne Imaging concludes successful virtual technology showcase
With more than 2200 registrations over three days and six sessions, the event included attendees from North America, Europe, and Asia Pacific. “We couldn’t be more pleased to offer these sessions, proving that even with the temporary closing of trade shows, individuals are keen to spend time online learning about the newest technology,” commented Dale Deering, Director of Market Development, Teledyne Imaging. “With such resounding success, we are planning on offering this showcase again in 2021.”
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IMVE article – 3D stacked technologies applied to custom CMOS image sensors – should you invest in differentiation?
IMVE article – 3D stacked technologies applied to custom CMOS image sensors – should you invest in differentiation?
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Teledyne e2v’s Rafael Romay Juárez to present on 3D Stacked Technologies at EMVA Business Conference
Rafael Romay Juárez, Executive Vice President and General Manager of Teledyne’s CMOS image sensors and aerospace & defense groups will give a presentation on 3D Stacked Technologies applied to Custom CMOS Image Sensors – A very solid reason to invest in differentiation. In it, he will review how modern 3D stacked technologies can be used to create next-generation CMOS image sensors able to effectively solve inspection challenges while drastically improving the SWaP-C of the inspection system
