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Understanding USBFS on Linux
This application note describes how USB-FS affects Linux users and why proper settings impact performance.
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USB 3.1 Multiple Camera Setup
This application note explores multiple USB 3.1 camera configurations. The purpose of this document is to provide a reference and a starting point for USB 3.1 camera users who wish to use multiple USB 3.1 cameras in their application.
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Using a USB 3.1 Camera with Intel NUC
This application note provides information on using a USB 3.1 camera in various Intel NUC (next unit of computing) configurations.
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Using Auto Exposure
This document explains the auto exposure function of the camera and how to configure the control properties for the feature.
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Using Cognex VisionPro with GigE Vision Machine Vision Cameras
This application note provides information on how to configure and use GigE Vision cameras with Cognex VisionPro. It guides new and current VisionPro users to understand the basics of GigE Vision, and how GigE Vision cameras support VisionPro controls.
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Using On-Camera Color Correction
This document provides a description of the color correction matrix (CCM) and provides instructions for the user to calculate a custom CCM.
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Using USB3/USB2 Cameras with Cognex VisionPro
This application note provides information on how to configure and use Teledyne FLIR machine vision USB3/USB2 cameras with third-party Cognex VisionPro software.
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Using Linux with USB 3.1
This Application Note explains the components and steps that are necessary to install and configure Linux for use with FlyCapture and USB 3.1. Testing is ongoing. Wherever possible, limitations have been noted; however, as more testing is completed this information may change. All possible configurations may not experience the same results.
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Teledyne’s new SWIR line scan camera enables defect detection beyond the visible
Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, is pleased to announce its first short-wave infrared (SWIR) line scan camera for machine vision. The new Linea SWIR features a cutting-edge InGaAs sensor in a compact package suitable for a variety of applications including food and packaged good inspection, recycling, mineral sorting and solar and silicon wafer inspection.
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New Linea HS 32k camera earns Platinum
Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, is pleased to announce that its newest charge-domain CMOS TDI camera – the Linea HS 32k TDI camera was awarded the Platinum Innovators Award by the Vision Systems Design 2020 Innovators Awards program.
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Teledyne DALSA introduces a thermal camera component for temperature screening systems
Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in digital imaging technology, is introducing a new member of the Calibir camera series, the GXF model, which may be used as a component in skin temperature screening systems.
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Teledyne DALSA’s Genie Nano-5G camera now in full production
Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in digital imaging technology, is pleased to announce that the new GenieTM Nano-5G M/C8100 camera, based on the ON Semiconductor 45M monochrome and color sensors, has now entered full production