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Teledyne Product and Part Identification
Identification encompasses a range of machine vision applications that involve reading printed characters and decoding 1D or 2D symbols on products. For traceability of production parts, verification of product lots or grading of print codes, Teledyne's Identification tools are designed for accurate results in the toughest of manufacturing environments.
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Teledyne Flaw Detection
Flaw detection is perhaps the most fundamental machine vision task. Vital to quality control, machine vision allows manufacturers to find contamination, scratches, cracks, blemishes, discoloration, gaps, pits, etc., and is used extensively across a wide range of industries from semiconductors to pharmaceuticals and automotive manufacturing.
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Teledyne Semiconductor Wafer and Mask Inspection for Quality Control
In semiconductor manufacturing, yield drives costs, so manufacturers inspect products at many points between bare wafers and packaged ICs, seeking to identify defects as soon as possible. As lithography geometries shrink, inspection systems need to be able to resolve defects on progressively deeper sub-micron scales (eg. 45 nm, 32 nm, 22 nm...). In the highest-performance situations, the features are so small that visible light can no longer resolve them, and inspection systems must use deep ultraviolet (DUV) wavelengths for illumination.
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Teledyne Continuous Web Inspection
Materials produced in a continuous roll or sheet, such as paper, textiles, film, foil, plastics, metals, glass, or coatings, are best inspected by line scan systems. Line scanning offers unlimited pixels in the in the direction of a web's motion with zero smear even at high speeds, higher dynamic range, greater processing efficiency and much lower price/pixel.
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Teledyne 3D Imaging
Increasing automation and monitoring, the use of robotics, and other aspects of Industry 4.0 initiatives are increasing the demand for 3D imaging solutions which offer high levels of accuracy and distance measurement in a variety of challenging conditions. This is essential in complex object recognition and dimensioning applications and for handling complex interaction situations such as the growing trend for human/robot co-working.
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Teledyne Verification
Machine vision systems are widely used for the verification of parts, assemblies and packaged goods. The range of verification applications are generally so broad, they utilize the same tools for positioning, measurement, identification and flaw detection. Verification is often combined with other tasks, such as measurement of part dimensions or reading of product barcode, to render 100% product inspection.
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Teledyne General Manufacturing Verification and Quality Control
Teledyne's world-leading vision components help manufacturers around the world apply vision technology to improve quality control, increase throughput, and automate tasks. Our products serve demanding applications in a wide variety of manufacturing systems--guiding robots, tracking parts and verifying every step of thousands of diverse assembly/production processes.
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New 5 MP Blackfly S GigE Camera with Pregius S – Lightest version in industry
Introducing the latest additions to our Blackfly S GigE camera line – the BFS-PGE-50S4M-C and BFS-PGE-50S4C-C. These 5 MP models are particularly well suited for integration into small handheld devices with their impressive low weight of 53 grams and high pixel density ideal for integrating with compact, less expense lenses. Leveraging Sony’s IMX547 sensor they deliver exceptionally low-light performance with superior quantum efficiency and very low absolute sensitivity making them suitable for a range of challenging applications from biometrics to scientific research and more.
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Teledyne FLIR IIS Launches Industry-First Deep Learning-Enabled Machine Vision Camera: Firefly DL
FLIR Firefly® DL is the industry’s first deep learning, inference-enabled machine vision camera with FLIR Neuro technology.
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Teledyne FLIR IIS Commits To Offering Best-In-Class Imaging Solutions For Demanding Factory Automation Applications
Next generation camera platform and imaging software leverage years of machine vision GigE camera design expertise and customer understanding to deliver best-in-class imaging reliability, quality, and performance.
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In vivo Spinal Cord Calcium Imaging
Dr. Biafra Ahanonu is a postdoctoral scholar and HHMI Hanna H. Gray Fellow in the lab of Prof. Alan Basbaum at UCSF, whose research primarily focuses on the neural and molecular mechanisms of pain. Dr. Ahanonu describes his work, “We are trying to understand how the nervous system changes in response to acute and chronic pain. If we can identify which neurons change, we can potentially modulate those neurons to reduce pain.”
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Third Harmonic Generation Nonlinear Optical Imaging
Prof. Suchi Guha’s research activity focuses on organic semiconductors and organic optoelectronics, making use of optical imaging and spectroscopy to investigate these materials and their properties.