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Teledyne’s Contact Image Sensors for high-speed, high-resolution line scan are now in production
Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are in production. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications.
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Teledyne DALSA Genie Nano-10GigE cameras in full production
Teledyne DALSA, a Teledyne Technologies company, is pleased to announce the new Genie™ Nano-10GigE M8200 and C8200 cameras, based on Teledyne e2v’s 67M monochrome and color sensors, have now entered full production.
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New Xtium2 frame grabber from Teledyne supports high-speed GigE machine vision cameras
Teledyne DALSA is pleased to announce its Xtium™2-XGV PX8, a GigE Vision® compatible image acquisition board that features a real-time depacketization engine to convert GigE Vision image packets into ready-to-use images. It also has a hardware-assisted packet resend logic that improves the reliability of image transfers while reducing the CPU overhead. Xtium2-XGV PX8 targets image acquisition from single or multiple independent 10, 5, 2.5, or 1GigE Vision area scan cameras, line scan cameras, and 3D profile sensors.
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Case Study: Critical infrastructure asset management using Teledyne imaging solutions.
Data Collection Limited advances road inspection, asset, and inventory management by integrating Teledyne’s Blackfly S and Ladybug spherical imaging cameras.
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Case Study: Achieving Accurate Commercial Building Occupancy Data Using Teledyne’s People Counting Solutions.
Prescriptive Data advances in real estate building automation by integrating Teledyne’s Brickstream 3D Gen2 Camera Sensors.
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Teledyne to present its newest mission-critical sensing solutions at SPIE’s Defense and Commercial Sensing exhibition
Teledyne will showcase their newest products and solutions at SPIE’s Defense and Commercial Sensing exhibition taking place April 5-7, 2022, in Orlando, Florida. Visitors to the Teledyne booth #1101 can expect representation from Teledyne FLIR’s OEM, Optics and R&D groups, and Teledyne’s DALSA, e2v, Imaging Sensors, Judson, Lumenera, and Princeton Instruments businesses. Product and application specialists will be available to discuss your specific requirements.
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The Importance Of Camera Sensitivity In Low Light Biological Imaging
Image quality comparisons when using cameras with varying sensitivity levels.How adjusting certain scientific camera parameters can impact sensitivity.
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Modernizing Spinning Disk Confocal Microscopy With New Camera Technologies
Image courtesy of Emma Sigfridsson, University of Edinburgh.Image courtesy of Christoph Leterrier, INP, Marseille, France.Image courtesy of Bernd Zobiak, UKE, Germany.
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Characterization and Properties of Color Centers in Silicon
Optically active color centers in the solid state are leading candidates for quantum information processing due to long spin coherence times and high-quality spin-photon interfaces, but traditional platforms based on diamond and silicon-carbide suffer from manufacturability and optical interfacing limitations.
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Efficient Spectroscopy for Material Science and Quantum Materials
3 unique capabilities of multistage spectrographs.How to measure signals close to the laser line and achieve high resolution from UV to SWIR.
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X-Ray Scattering Overview
X-ray scattering measures the patterns, intensities, and angles of scatter produced when a sample is illuminated by an x-ray beam. X-ray scattering is advantageous as it is a non-destructive technique, typically used alongside x-ray microscopy and x-ray spectroscopy.
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Teledyne e2v Announces New 5Mpixel CMOS Image Sensor for High-speed Scanning and Embedded Vision Solutions
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces the expansion of its Snappy family of image sensors with a new 5 Megapixel device.
